>>> 'gartek' problem from hebert -- Wed Jan  3 08:37:20 1990 <<<

Problems: 1) Ar MFC (0-1000 sccm) leaks Ar at 500 sccm when the
             controller is programmed for 0.0 sccm flow.
          2) The target cooling water needs algae removed and
             the coolant replaced.

Solution: 1) The Ar MFC that looked bad on 1/2/90 is OK today.
             The MFC must have had a dust particle preventing
             it from fully closing. I will NOT need the UNIT MFC
             afterall to replace the Vac Gen MFC.

           
Problem #2 still needs attention.

>>> 'gartek' problem from hebert -- Thu Jan  4 14:36:28 1990 <<<

Problem: Load loack sputter etch station not working.

Solution: I cleaned and rewired the power cables to the
powered substrate table. I improved the isolation between the
top powered section of the table and the grounded bottom section
of the table by replacing the stainless screws and teflon
insulators with nylon screws and teflon insulators. 

The top ground shield had been modified during the load lock
sputter deposition project that failed in late December '89.

The plasma not ignites at pressures as low as 10 mTorr. It used to
ignite only about 20 mTorr. The RF pot setting for 100 W is now
1.60. Previously it was 2.40.  

I checked the etch rate of thermal oxide (SiO2) on a clamped 100 mm
wafer. Previously the thickness varied by 9 to 10 percent after sputter
etching a substrate. Now the thickness variation is less than 1.0 percent
after sputter etching a 100 mm wafer.

THe sputter etch station is up.

>>> 'gartek' problem from rnorman -- Mon Jan 22 08:40:36 1990 <<<

The cryo's were regened after the power shutdown, but due to a misunderstanding
were regened again.  At this time the cryo's are under regeneration,
Dave is taking care of it.

>>> 'gartek' problem from bob -- Tue Jan 23 10:47:17 1990 <<<

The cryopumps on the gartek have been regenerated and the gartek is
up for use.

>>> 'gartek' problem from evan -- Wed Feb 28 14:31:32 1990 <<<

The taurus box does not seem to be activated when gartek enabled.  Is this
actually hooked up to anything?  

>>> 'gartek' problem from hebert -- Mon Mar  5 16:06:32 1990 <<<


Problem: Quartz lamp in load lock caused RF cable to melt. Teflon
deposited on LL surfaces. The heat control was set to 80 deg C.

Solution: I dismanteled the load lock and I'm cleaning all parts
and surfaces. I should complete this in the morning.

>>> 'gartek' problem from hebert -- Wed Mar  7 09:21:26 1990 <<<

Problem: Quartz lamp in load lock overheated RF cable to powered
substrate table and caused teflon insulation to melt. The teflon
coated the inside of the load lock.

Solution: I took apart the load lock and cleaned all surfaces.
I ran on O2 plasma ans Ar plasma afterwards to to further clean the
chamber.

The RF sputter etch is now UP. I sputter etched a 100mm wafer (clamped)
using 100 W RF (2.0 RF pot setting); 50 sccm Ar (7 mTorr); for 300 seconds.

              T        C       B       L       R
Init XOX   1399 A    1400   1399    1396    1395
Init Nf    1.459     1.458  1.459   1.456   1.459

Final XOX  1295 A    1287   1292    1296    1286
Final Nf   1.459     1.459  1.459   1.460   1.459

etch rate: 21.4 A/min

Since Nf is the same for SiO2 before and after sputter etch cycle,
the load lock seems to be clean enough that no teflon residue is present
to deposit on the substrate.

>>> 'gartek' problem from hebert -- Wed Mar  7 09:31:11 1990 <<<

Problem: Unstable DC power supply. When pot is set at 4.68, the power
varies from 2.9 to 3.2 kW. Normally the power is 2.9 to 3.0 kW.
There is also a dead band in the pot, where changing the pot setting
has little or no effect of output power. THe problem exists with both
the Al and Nb target, and when directly linking the power supply to each
target (by-passing the DC target switch).

There is probably a bad SCR in the supply. Peak power is only 4.5 kW.
It should be 5 kW.

>>> 'gartek' problem from rnorman -- Thu Mar  8 11:18:19 1990 <<<

Prower fluctuating from 2.9 - 3.0 KW is now fluctuating from 2.9 - 3.2 KW.
Dead band in knob and max power is now 4.5Kw instead of 5.0Kw.

See comment for details.  Most of these problem could be caused by plasma
fluctuations or Process changes, such as pressure.  I need to talk to
Hebert before continuing.

>>> 'gartek' problem from hebert -- Fri Mar  9 15:35:14 1990 <<<

The load lock mech pump oil filtration system has a torn poly
tube that caused oil to leak onto the floor in CY1. I turned off
the mech pump and put towels around the oil on the floor.

>>> 'gartek' problem from bob -- Fri Mar  9 15:59:16 1990 <<<

TThen oiline on the filtration unit if the gartek broke at the 
connection to the oil filtration pump. It has been repaired and
the oil cleaned up. The system is up.

>>> 'gartek' problem from hebert -- Fri Mar 23 08:01:40 1990 <<<

Power glitch caused turbo to shut dpown and load lock to vent. Leaky
seal at door between load lock and process chamber caused pc cryo
to dump. The cryo pumps rae being regenerated.

>>> 'gartek' problem from hebert -- Mon Mar 26 15:44:42 1990 <<<

Problem: PC base pressure is fluctuating between low 10E-6 Torr
and low 10E-7 Torr. This morning the base pressure was in the
mid 10E-8 Torr range. At 11 AM the base pressure started fluctuating.

The XPS chamber is at about 8 x 10E-8 Torr. When the door separating
the PC and the XPS chambers was opened, the pressure was in the 
low to mid 10E-7 Torr range. 

The He pressure in the compressor is 260 to 270 PSI.

I'm not sure at this time what is causingf the base pressure in the
PC to fluctuate. Both cryo pumps were regenerated last Friday after
a power glitch caused the pumps to warm to 30 deg K. The load lock
to PC door leaked and caused the PC cryo to warm.

>>> 'gartek' problem from hebert -- Tue Mar 27 08:15:06 1990 <<<

Problem: Base pressure in PC fluctuating after sputtering. The 
base pressure recovers after several hours.

Solution: RNorman recharged the cryo compressors to the XPS and
PC chamber. The base pressure in the PC fell from 5.6 x 10E-8 Torr
to 4.3 x 10E-8 Torr after recharging the PC cryo compressor. The
PC cryo compressor was about 30 psi low.

The Gartek cryos will now be regenerated.

The Gartek will be up either this afternoon or in the morning, depending
on how fast the base pressure gets into the 10E-8 Torr range after
regen.

>>> 'gartek' problem from hebert -- Mon Apr  2 21:28:57 1990 <<<

The base pressure in the PC is not recovering after sputtering.
Last week I had a problem with the base pressure fluctuating
between the 10 E-6 Torr range and the 10E-7 Torr range after sputtering.
Normally it recovers to the mid 10E-8 Torr range within a minute or
two of sputtering any film. 

Last week He was added to the compressors. I ran a test afterwards to
check the critical temperature of our niobium film. For the test, I
pumped 150 sccm Ar with the PC cryo for 10 minutes, then I deposited
3000 A Nb (90 s dep t), and the base pressure fell into the low
10E-7 Torr range right away after sputtering. The Tc of the film was
9.2 degrees Kelvin (perfect).

Tonight the base pressure in the PC stays in the low 10E-6 Torr range after
sputtering. The PC pressure falls into the 10E-8 Torr range if I pump
on the PC and XPS chamber with only the XPS cryo, and the pressure
in both chambers rises into the 10E-6 Torr range with both pumps
pumping on both chambers.

Initially the base pressure in the PC was 6.5 x 10E-8 Torr. I am warming
both cryo pumps. I'll swap the compressors in the morning and clean the
cryo check valves. I'll start up the compressors and see if the problem
goes away. If not, the PC cryo may have to be rebuilt. 

>>> 'gartek' problem from hebert -- Tue Apr  3 11:22:48 1990 <<<

OES of Al dep using the same scan conditions as last year show
an increase in N2 and He peak heights since the pump was rebuilt.
This suggests that there is a He leak within the cryo pump that 
is causing the arrays to saturate, and N2 to dump.

I will pull the cryo pump off of the PC this afternoon. 

>>> 'gartek' problem from hebert -- Tue Apr  3 15:53:25 1990 <<<

The process chamber cryo pump (CTI S/N:16J47899) was replaced with
a new CTI-8 (S/N 9J47650). The old CTI-8 was rebuilt in March '89.
It was determined by OES that the old pump was dumping O2, N2, and
COx (x=1 or 2). The He peak height was also greater than that observed
last year after the rebuild. 

The N2 purge was not installed onto the new cryo pump. The new cryo has
a digital cryo temp readout.

I'd like to thank James Parrish for his assistance in the installation of the
new pump!

I'm roughing out the cryo's over night to see base pressure before the 
cryo compressors are turned on. 

>>> 'gartek' problem from hebert -- Wed Apr  4 16:06:05 1990 <<<

The DC sputter controller won't power up. I tried resetting the
circuit breakers and turning the key, but was not successful
at getting it to turn ON.

>>> 'gartek' problem from rnorman -- Thu Apr  5 08:01:55 1990 <<<

Problem: DC supply control panel not turning on, no LED display.

Cause: Fuse F5, 24 volt supply, a 2 amp fuse was blown.

Solution: The DC power supply was opened up.  The AC power from the 
          main braker was present.  Below the main braker is 5 fuses
          the far right one is F5 for the 24 volt supply, it was replaced.
          The gartek is up.

>>> 'gartek' problem from hebert -- Thu Apr  5 11:05:47 1990 <<<

1) Power supply (DC): RNorman replaced fuse in the DC supply, and
   DC controller came up.
2) I installed the heater blanket on the new PC cryo pump.
3) The base pressure this morning before presputterinfg the targets
   and before degas of IG was 2.5 x 10E-7 Torr. The heat tapes overloaded
   the power strip, so I don't know how long the chamber was baked.
   The base pressure is normal for a chamber that has been baked out for
   less than 24 hour after cleaning. 
4) The PC chamber cyo temp remains at 8 deg K after pumping on the chamber
   for almnost 24 hours. This pretty much eliminates any concerns about
   chamber leaks after the chamber was disassembled for cleaning.
5) I tested the new cryo pump to see how much it warmed up when pumping
   Ar. Pumping 240 sccm Ar for 20 minutes, the cryo temp did not exceed
   10 degrees K. Raising the flow rate to 640 sccm, the cryo temp did NOT
   exceed 16 degrees K, after pumping at this flow rate for about 2 minutes.
   The Ar flow rates have been corrected (i.e. mulitiply N2 cal MFC reading
   by 1.6).
6) I am baking the chamber again to help reduce the base pressure.

>>> 'gartek' problem from hebert -- Fri Apr  6 07:38:20 1990 <<<

The cryo compressors have low He pressure. This is from swapping
compressors before the new cryo was installed, and then compounded
by the installation of the new cryo pump. The He pressure is about
260 PSI in the compressors. 

I'd like to have these recharged with He.

>>> 'gartek' fix from hebert -- Fri Apr  6 08:04:09 1990 <<<

RNorman recharged both cryo compressors with He.

The base pressure this morning in the process chamber was 1.0 x 10E-7 Torr
before presputtering the targets or degassing the IG. This is good,
considering that the heat tapes turned off at 4 AM and that it takes
about 6 hours for the chamber to cool down. After presputtering the
targets and degassing the IG the PC base pressure is 5 x 10 E-8 Torr.
Normally it is about 2 x 10E-8 Torr after doing this. I expect the
system to UP by 10 AM this morning.

>>> 'gartek' problem from parrish -- Mon Apr 16 08:40:02 1990 <<<

oil line busted on the filtration unit,system is down

>>> 'gartek' fix from parrish -- Wed Apr 18 10:22:14 1990 <<<

problem:    oil on the floor

cause:      oil line broke

solution:   cleaned up oil,refilled pump(without oil filtration unit)and
            started pump.

>>> 'gartek' problem from hebert -- Mon May 14 12:15:27 1990 <<<

The mech pump that backs up the load lock turbo is noisy. It sounds
like the fan to the electric motor is loose.
