>>> 'lam2' problem from carlos -- Mon Jan  9 07:20:42 1989 <<<

The receiving cassete sensor is not working. My wafer is inside
the exit chamber but the machine will not run the cleanup progam
because it can't detect the receiving cassete

>>> 'lam2' problem from rnorman -- Mon Jan  9 11:32:52 1989 <<<

Problem: The exit cassette not indexing down/up when tilted.

Cause: The cassette sensor was out of adjustment. 

Solution: The upper Hine indexer sensor was tilted out of adjustment;
          it was readjusted. This is the second time in the last month
          or so this problem has occured. I think people are not waiting
          for the cassette to come to the top before they take the cassette
          off; this is a NO! NO! When your wafers are done you tilt the cassette          ever so lightly and it will automaticly index to the top; and after
          that you may pick up the cassette and get your wafers. DO NOT pick the          cassette up when it is in the down possition. The lam2 is up.

>>> 'lam2' problem from rnorman -- Wed Jan 11 11:23:02 1989 <<<

The lam will be down to install nem software compatable with lamlink.

>>> 'lam2' problem from rnorman -- Wed Jan 11 11:25:28 1989 <<<

Problem: No SECS link between lam2 and host computer.

Cause: The software was not compatable with lamlink.

Solution: The new software, REV 7.24, was installed. This software is
        compatable with lanlink and also has many other ungrades, the 
        software log has been installed in the Lamlink Communication
        Manual for your referance. One addition I like is on the
        "Parameters" page there is a "chamber leakback" test.
        The lam2 is up. By the way, the manual is next to the host
        computer in VLSI, on clean room paper.

>>> 'lam2' problem from jlou -- Wed Jan 11 18:32:09 1989 <<<

Lam2 shows rf-mismatch.Carlos just turned off power and solved this trouble.
So far it runs well.

>>> 'lam2' problem from jlou -- Thu Jan 12 03:08:28 1989 <<<

Lam2 still shows rf-mismatch.

>>> 'lam2' problem from rnorman -- Thu Jan 12 11:39:55 1989 <<<

Problem: RF mismatch error.

Solution: I could not duplicate the error; ran with no problems.
          Did the user make sure the recipe was loaded? I did install
          new software before that time, but did not enter in the recipe.
          The lam2 is up.

>>> 'lam2' problem from rnorman -- Fri Jan 13 15:28:23 1989 <<<

The Lamlink is not working properly still. I called Peter Byron of
Brookside Software and we checked a few things. It looked like we
had a bad Serial I/O PCB, so I switch it out with lam1; but, there
was no change. We still get error: "No SECS link" on lam, and 
"checksum error" on the host computer. The cable between the two
was checked and it was good. So, Next tuesday at 11AM  Peter will
be up to check it out with his porable computer. 

Note: The lam is still operational, just the lamlink is down.

>>> 'lam2' problem from rnorman -- Thu Jan 19 11:30:53 1989 <<<

Problem: Getting "NO SECS LINK" error.

Cause: The RS232 cable was intermittant between the lam and host
       computer.

Solution: Phil replaced the cable connectors. The cable was tested
          on lam1 and had no problem. We now have two lamlinks, one
          for lam1 and one for lam2, but one serial port on the back
          of the host computer; so, we either need another serial card
          or a switch box. The lam2 is up.

>>> 'lam2' problem from jlou -- Sun Jan 22 14:52:54 1989 <<<

I think the sensor of receiving cassette is broken.I left two wafers in the system.I tried several times to get them out,but it is in vain.I hope you can take these two wafers out for me and check the sensor.
                                           Thanks 
                                                                 J.C.Lou

>>> 'lam2' problem from rnorman -- Mon Jan 23 08:50:10 1989 <<<

Problem: Exit cassette not going home.

Cause: The sensor was moved way out of place, like it was hit by the cassette
       when it was pulled out.

Solution: The sensor was readjusted and the cassette was tested. I also replaced          one of the Rt Drive belts, because it was broken. The lam is up.

>>> 'lam2' problem from jlou -- Mon Jan 23 13:39:39 1989 <<<

It shows RF mismatch again.
I already do clean running to get the last two wafers out, but I think
there is a problem in receiving cassette.
I doubt the sensor there  is not stable. Sometimes it runs well, sometimes
it doesn't. Could you take a look again.
                                                       Thanks
                                                            J.C. Lou

>>> 'lam2' problem from rnorman -- Mon Jan 23 16:51:24 1989 <<<

Problem: The Exit cassette sensor.

Cause: The sensor was out of alignment again.

Solution: The sensor was adjustmed; but how does it get out of adjustment?
          I would like to talk to jlou about this. The lam is up.

>>> 'lam2' problem from aplee -- Tue Jan 24 21:09:31 1989 <<<

One of the convey belts to the receiver was broken before I used it,
but somehow nobody entered the problem. I realized after I put two
wafers in and the 2nd one is stuck in the right chamber. I etched
both with high power for 1 min. 

>>> 'lam2' problem from jlou -- Wed Jan 25 20:15:31 1989 <<<


The sending belts do run well.I have to use my hands to push wafers to 
the right position.

>>> 'lam2' problem from rnorman -- Thu Jan 26 08:43:26 1989 <<<

Problem: The entry side belts moved real slow.

Cause: Most of the belt were old and streched out.

Solution: All the belts on lam2 were replaced; the entry side works
          good now. We need to order more of the following belts:

   LT. track connect belt..........# 734-4046-1.......1ea.
   LT. motor drive belt............# 734-1682-1.......1ea
   LT.& RT. front belts............# 734-4049-1.......4ea
   Hine indexer belts (from Hine)..# 2503-2130........4ea

The lam2 was tested and is up for use.

>>> 'lam2' problem from weijie -- Tue Jan 31 14:44:08 1989 <<<

Nonuniformity and wrong endpoint detect.

1. after ~1 min. LS etching, it's oxide of ~700 - 800A on 
   one side and ~300A on the other side.  It's not circular
   nonuniformity. Maybe due to the unparallel plates.

2. A 1:30 LS etch time is set. But it only etched for 55 sec. 
   due to the endpoint and left about 700A oxide on the wafer.
   I had to etch for another 30 sec. to etch all the oxide.

>>> 'lam2' problem from carlos -- Tue Feb  7 21:40:38 1989 <<<

etching rate in 850W step was 0.4um/min. This is 50% of the 
normal rate. Please someone tune the lam2 up.

>>> 'lam2' problem from rnorman -- Fri Feb 10 15:25:49 1989 <<<

Problem: Etch rate not normal.

Solution: The process chamber was very dirty and was in need of cleaning.
          I did a PM clean and after ran a plasma clean with no O2. The 
          lam2 is up for use.

>>> 'lam2' problem from jchung -- Sat Feb 11 18:39:46 1989 <<<

Lam2 is reporting low water flow.  This problem occurred
sometime between 5pm and 7pm on Saturday 2/11

>>> 'lam2' problem from rnorman -- Mon Feb 13 11:40:09 1989 <<<

Problem: "low water flow" error.

Cause: The water chiller went out.

Solution: The drive pin between the chiller motor and pump
          was stripped. Phillip replaced it and both lams
          are up.

>>> 'lam2' problem from rnorman -- Mon Feb 13 16:39:29 1989 <<<

Lam2 has a "low water flow" error. This is because the chiller is 
down. I did connect the chiller water line to DI, but there is not
enough flow getting to the lam2. The DI water is connected to both
lam1 and lam2, but lam2 water sensor is set too high. If you can not
wait for the chiller to get fixed I could "make" the lam2 work?

>>> 'lam2' problem from rnorman -- Tue Feb 14 11:55:59 1989 <<<

Problem: "Low water flow" error.

Cause: The lam chiller went down with a bad water pump. So, I 
       connected the lams to the DI loop; which did not have
       enough water flow at the VLSI end.

Solution: I found a dead DI loop in parallel with the lams, so I
          removed it. The lams now have much more DI water flow
          then before, atleast twice as much. The lam2 is now
          up for use.

NOTE: The new water pump will be is shortly, latest by 2/16.

>>> 'lam2' problem from weijie -- Tue Feb 14 15:42:25 1989 <<<


Wrong endpoint detection.

Endpoint is triggered while I still have about 800A left.
Also the uniformity isn't that good.

>>> 'lam2' problem from rnorman -- Wed Feb 15 14:50:05 1989 <<<

Problem: Unifority isn't that good around wafer.

Solution: I did a chamber clean, but that didn't fix the problem.
          So, I checked the parallelizm of the upper and lower 
          electrode. Measured CCW around the electrode it was
          with in 1-2 thousandths, very good; .218", .219", .218,
          and .218". The electrode is very parallel. The lam is up.

>>> 'lam2' problem from rnorman -- Thu Feb 16 10:36:45 1989 <<<

The lam2 is in need of an upper cathode replacement. This will take about
a half day to install. I will be going down either today or early tomorrow
to get the new Graphite Cathode, lam part number 716-6711-1; and shortly
after be installing it. 

Note: The lam is not down yet, but will be in the next day or so. You will
      be informed when it does go down.

>>> 'lam2' problem from rnorman -- Thu Feb 16 11:11:36 1989 <<<

Problem: A entry side front belt broke and there was a RF mismatch error.

Cause: I don't know why the belt broke, because those are new belt on there.
       The RF Mismatch was due to the gap spacing and high Rf power.

Solution: The belt was replaced and the RF power was reduced. The lam was tested          and it is now operating.

>>> 'lam2' problem from eskim -- Thu Feb 16 18:00:07 1989 <<<

Alarm is on for arm stuck at exit airlock.
There are two wafers stuck in the chamber, which are causing
this problem.  It happened while wafer cleanout was being
run after a wafer was stuck in the chamber due to RF mismatch.

>>> 'lam2' problem from jlou -- Thu Feb 16 21:40:10 1989 <<<

I just try to control some parameters to release the arm lock
but it is in vain.
                                              JLOU

>>> 'lam2' problem from carlos -- Fri Feb 17 00:40:52 1989 <<<

arm stuck at entry airlock alarm on.

>>> 'lam2' problem from rnorman -- Fri Feb 17 09:34:58 1989 <<<

The arm is stuck all right, what happened? Someone was doing something
wrong. The system is in a possition it could not put it self in.
The lam2 will be down to CLEAN UP this mess and to replace the graphite
cathode.

>>> 'lam2' problem from rnorman -- Fri Feb 17 14:50:21 1989 <<<

Problem: The exit arm was stuck inside the process chamber.

Cause: Somehow a wafer got broken and a chip slipped under the chuck
       which prevented the chuck to go down. The exit arm hit the chuck
       durring a user activated "wafer clean out" and stuck there.
       The lam had stopped at first due to a "RF unstable" error, caused
       by the user modifying the recipe.

Solution: The wafer chips were removed and returned to the user; no damage
          was done to the chuck or the arm. The graphite cathode was replace
          due to contamination, polymer, stuck to it. The lam was tested and
          operates well. A chamber process clean was done; 800W @ 85sccm of He
          and 200 sccm of CF4 with a gap spacing of .38 cm for 10 min. The 
          chamber has a ROR of 2.9 mtorr/min, the new cathode is still probably
          out gassing. The lam2 is up for use.
From rnorman Tue Feb 21 09:59:12 1989
Received: by argon (5.57/1.16)
	id AA15902; Tue, 21 Feb 89 09:59:02 PST
Date: Tue, 21 Feb 89 09:59:02 PST
From: rnorman (Robert L. Norman Jr.)
Message-Id: <8902211759.AA15902@argon>
To: lam2
Subject: lam2 comments 
Status: R

After the graphite cathode change on friday the rate of rise or
outgassing inside the chamber this morning is 1 mtorr/min. This
is very good compaired to friday's which was 2.9 mtorr/min. The
lam2 ROR is normal for this it and is ready for use.


>>> 'lam2' problem from robin -- Fri Feb 24 08:18:52 1989 <<<

LOW WATER FLOW alarm started at 8:18 this morning.

>>> 'lam2' problem from lsfan -- Sat Feb 25 00:52:48 1989 <<<

a message of "low water flow" is flashing.  I don't know
where is it stucked.

>>> 'lam2' problem from rnorman -- Tue Feb 28 16:35:48 1989 <<<

The RT. side front belt broke; it was replaced and is now up for use.

>>> 'lam2' problem from rnorman -- Thu Mar  2 12:37:32 1989 <<<

Problem: MFC's 1, 2, 4 & 5 not at zero.

Solution: I went in and zeroed all MFC's. The lam2 is up.

>>> 'lam2' problem from jchen -- Thu Mar  9 21:38:16 1989 <<<

Tested several wafers, for the last one I used gap distance=0.6 cm
and power=400 W and cannot etch the LTO oxide while I can get reasonable
etch rate at same power and larger gap distance (0.8 cm, 1.0 cm and 1.2cm).
I suspect this have something to do with the gas (ran out of CF4?, not likely
because it gave me right reading) or the chamber needs to be cleaned.

>>> 'lam2' problem from carlos -- Fri Mar 10 01:33:36 1989 <<<

it etches too slow. Same problem as reported by jchen.

>>> 'lam2' problem from rnorman -- Fri Mar 10 14:38:18 1989 <<<

I keep on getting a "RF Mismatch" error. It could be a cable.
I will work on it on monday.

>>> 'lam2' problem from jlou -- Sun Mar 12 14:08:56 1989 <<<

It still shows mismatch.

>>> 'lam2' problem from jlou -- Mon Mar 13 11:15:13 1989 <<<

Lam 2 still shows mismatch and also it doesn't do any etching.

>>> 'lam2' problem from carlos -- Tue Mar 14 04:22:52 1989 <<<

RF mismatch. The maximu power delivered is 37W. Please fix this 
ASAP.

>>> 'lam2' problem from rnorman -- Tue Mar 14 12:28:22 1989 <<<

Problem: RF mismatch error; max supply power is 37 W, Ref 52.

Cause: A relay was latch-up in the box where the RF Interface PCB is.

Solution: The relay was taken out and 24V was applied to it which unlatched
          the relay. A new relay will be ordered for replacment, P&B #
          R10-E1-Z2-V700 @ 24Volts. The lam is up for use.

>>> 'lam2' problem from carlos -- Tue Mar 28 01:59:10 1989 <<<

the etching rate is too low. Also the exit cassete does not raise.
I may have kicked the optical sensor out of alignment.

>>> 'lam2' problem from robin -- Tue Mar 28 10:43:49 1989 <<<

LOW WATER FLOW alarm sounding.

>>> 'lam2' problem from rnorman -- Tue Mar 28 11:18:21 1989 <<<

Problem: Low water flow, low etch rates and exit cassette not indexing home.

Cause: The low water flow went away after I opened and closed the water supply
       valve; it either was caused by the new water pump being install, as
       I write, or some debris in the water flow sensor causing an error.
       The low etch rate; I'm not sure it is a "real" problem, I need to talk to       carlos. This could be caused by many things: modified recipe, something
       common with his wafers, dirty chamber or RF supply acting up. The 
       cassette sensor was out of adjustment also.

Solution: Adjusted exit cassette sensor and super glued it down. The water
          problem went away, and the lower etch rate will need futher 
          analysis. The lam2 is up.

>>> 'lam2' problem from lyons -- Tue Mar 28 19:18:27 1989 <<<

did 16 wafers for Carl Galewski, etching 1 um on each wafer.

noted a very strong bullseye pattern with the center ~600A
oxide left when edges cleared.  also several (5) of the 16
wafers endpointed way too soon due to the noise on the end
point signal.

>>> 'lam2' problem from moazzami -- Tue Mar 28 22:23:14 1989 <<<

VERY nonuniform etching. Also, etch rate much lower than normal
(3500A/min versus <1500A/min).
Are the electrodes parallel? Is the gap spacing messed up?

>>> 'lam2' problem from rnorman -- Wed Mar 29 15:52:58 1989 <<<

Problem: Ununiform etching.

Cause: The chamber was VERY dirty, covered with polymer. This has a
       major effect on the etch rates, endpoint, film quality, etc.
       There was no polymer on the graphite cathode.

Solution: I did a PM chamber clean. The etch rates should be closer
          to normal now. At this time the ROR is 3.4 mt/min; which is
          normal due to the chamber still out gassing from the cleaning.
          This was after a process chamber clean, which was ran after the
          PM cleaning. The lam2 is up.

NOTE: It would be good to run the "Chamber Clean" module regularly before
      or after your wafers. This will reduce polymer build up.

>>> 'lam2' problem from rnorman -- Thu Mar 30 08:02:54 1989 <<<

We have us a major problem here lam2 users; the chamber is dirty
again this morning, but worse, the graphite cathode is covered with 
polymer. Very bad. The chamer will have to be cleaned again, worse
then that the graphite cathode may even need to be replaced! 
Someone was running something they were not suppose to.

>>> 'lam2' problem from rnorman -- Thu Mar 30 09:15:09 1989 <<<

Problem: Chamber and graphite cathode covered with polymer, after
         cleaning it yesterday.

Cause: Some users are modifying the plasma, which can cause polymer
       to collect on the cathode, and/or someone was running nitride
       wafers. But no one ran the new "Chamber Clean" module to clean
       up their mess.

Solution: I opened the chamber and found the "mess", so I closed it and
          ran the chamber clean recipe. After which I opened the chamber
          and the graphite cathode was clean along with most of the polymer
          on the lower electrode. So, run the "Chamber Clean" module it works.

          I also was getting an RF Mismatch error, with about 57 Watts reflected          power and 37 watts foreward; this happened about a month ago and at 
          that time the relay in the RF Interface box was intermittant, so I
          replaced the relay with the one I ordered. But still had the same
          problem; I found the RF tunning cap drive motors at the end limit
          switch, so I moved them off the limit and it worked fine.
          The lam2 is up again; PLEASE RUN THE "Chamber Clean" MODULE.

>>> 'lam2' problem from jlou -- Thu Mar 30 15:57:16 1989 <<<

Today I etch 9 pieces of wafers. The oxide thickness is 9500 A.
I etch each wafer 4 times. The recipe of each run is:
step 2  2 sec ( I did not change the recipe).
step 4  1 min ( 900w ;H2 120; CHF3 45; CF4 40 ).
The etching rate is around 2700-3200 A. Uniformity is not good. I got
so called BULL-EYE patterns. Overetching has already solved this problem in the last run.
                                                              Jlou

>>> 'lam2' problem from jlou -- Thu Mar 30 23:37:31 1989 <<<

I etch 3 wafers. The oxide thickness is 2700 A.
Vertical etching recipe. etching duration is 1 min.
After this etching I run clean program for 25 min.
                                                    Jlou

>>> 'lam2' problem from jlou -- Fri Apr  7 22:09:39 1989 <<<

I etch 22 wafers.The oxide thickness is 1.1um. In order to get good uniformuniformity I etch each wafer step by step. Each step it takes 30 sec to 60 sec.
In step 4 the parameters are
2.8 torr
900 watts
He 120
CF4 45
CHF3 40
It works well.

>>> 'lam2' problem from eminami -- Wed Apr 12 20:50:31 1989 <<<

Says "Warning: Wafer in System" or something like that and will
not let me start my process.

>>> 'lam2' problem from tom -- Thu Apr 13 10:18:32 1989 <<<

Problem: Error "Wafers in system."
Cause: Unknown.
Solution: Run wafer clean out.

>>> 'lam2' problem from rnorman -- Wed May  3 11:59:33 1989 <<<

The lam2 is down for a chamber clean; it is now running a plasma
clean and will be up for use by 1PM if the chamber is leak tight.

>>> 'lam2' problem from rnorman -- Wed May  3 13:59:43 1989 <<<

Problem: Chamber in need of cleaning.

Cause: Normal usage.

Solution: The chamber was cleaned out and a 15 min plasma clean
          was ran. A rate-of-rise test was done for 10 min and
          the ROR is at 6mt/min; this is normal after a chamber
          clean. By tomorrow the ROR will be down to about 1mt/min.
          The lam2 is up.

  NOTE: Please continue running the "chamber clean" modual after you
        are done with you process; especially NITRIDE USERS.

>>> 'lam2' problem from jchen -- Thu May  4 00:18:43 1989 <<<

The pen in end-point ploter is all dry out. Could someone replace it
or tell me where can I get it? Thanks.

Jian

>>> 'lam2' problem from jchen -- Thu May  4 01:30:29 1989 <<<

When I was trying to load the O2 scourge program, it keeped telling
"BAD MODULE".

>>> 'lam2' problem from jchen -- Thu May  4 01:46:36 1989 <<<


Lam2 works fine untill I etch my 4th wafer. The alarm sounds and
shows the "wait for loop stab, pressure" problem. The wafer is still
in the chamber and I cannot find a way to take it out. This is really
urgent, could someone pls help me out? Thannnnnks! I will try to come
early in the morning.   -Jian

>>> 'lam2' problem from rnorman -- Thu May  4 08:20:31 1989 <<<

Problem: Bad Module error.

Cause: "O2" scurge module is for the lam1 not lam2; the module recipes
       are inter-protected so the wrong recipe can not be loaded into
       another system.

Solution: The module plasma cleaning of the lam2 is labeled "Chamber Clean".
          I will also label this "lam2" so there will be no confusion.
          Robin tested the lam2 and it is up.

>>> 'lam2' problem from robin -- Thu May  4 09:50:12 1989 <<<

Etch rate *extremely* low.  

>>> 'lam2' problem from robin -- Thu May  4 09:50:50 1989 <<<

Addendum to previous problem:

This applies to the standard process low selectivity etch (step 2).
Normal etch rate is 7000-8000 A/min.  Current rate < 1000 A/min.
Robert Norman and Evan Stateler are looking into the problem.

>>> 'lam2' problem from rnorman -- Thu May  4 12:50:20 1989 <<<

Problem: Etch rate very low.

Cause: It looks like a major cause was the CF4 bottle was low; also,
       the RF output power from the generator was 50 watts lower then
       setpoint power.

Solution: Evan installed a new bottle of CF4, inwhich the gas line
          was pumped to the chamber and purged with CF4. I also 
          adjusted the RF Interface board to bring up the RF
          generator power to that of recipe setpoint. The reflected
          power was also off a little and needed adjustment.
          A shorter and better RF cable was installed which reduced
          the RF reflected power by a factor on 3; from 15 W to 5 Watts.
          After replacing the CF4 a wafer was ran and etched normally;
          8800A before etching, 170A after processing. The lam2 looks
          and is running normal. Let me know how your wafer look.
          The lam2 is up.~v

>>> 'lam2' problem from carlos -- Wed May 10 01:11:49 1989 <<<

The etching rate is very slow ( < 1000A/min for 700W , SiO2).
The etching is EXTREMELY nonuniform and also we have polymer 
deposition. Please fix it right away.

>>> 'lam2' problem from carlos -- Wed May 10 01:54:30 1989 <<<

The problem was alleviated when I purposedly did a 4 min oxide 
etch @850W. It seems that for slow etches, the gases inside are 
more than needed for the etch, hence they deposit on the wafer 
forming an sticky passivation layer. 

>>> 'lam2' problem from jchung -- Thu Jun 15 10:45:49 1989 <<<

Lam 2 is sounding low water flow alarm at 10:45.

>>> 'lam2' problem from rnorman -- Thu Jun 15 11:57:46 1989 <<<

The lam chiller is down it looks like it has a shorted motor in it.
So, the lam2 will be down until about 1:30P
to connect an additional water supply.

>>> 'lam2' problem from rnorman -- Thu Jun 15 13:19:39 1989 <<<

Problem: Alarm "Low H2O flow".

Cause: The lam chiller motor burnt out causing
       H2O flow to the lams to stop.

Solution: The chiller was disconnected for the lams and
         the DI loop was connected.  No contamination will
         occure in the DI loop due to the water in the chiller
         is purified to 18 megaohms.  The lam2 is up.

>>> 'lam2' problem from jimmoon -- Sun Jun 18 09:14:18 1989 <<<


RF MISMATCH error terminated the etch after about 8 seconds.

>>> 'lam2' problem from jimmoon -- Sun Jun 18 10:49:57 1989 <<<

Same as before -- RF MISMATCH shortly after etch begins.

>>> 'lam2' problem from rnorman -- Mon Jun 19 14:20:58 1989 <<<

Problem: RF Mismatch shortly after etch begins.

Cause: I ran 3 wafers with no problems. The user may have ran a
       modified process recipe; cause is unknown.

Solution: I ran 3 wafers: first one with the "Chamber clean" recipe, then
          2 with the SiO2 recipe with no problems.  After testing I ran
          the chamber clean recipe with "process only", no wafers. I'm
          sorry it looks like it is running fine. Due to Tom wanting to use
          the lam I did not vent the chamber to see if it is dirty, this can
          causes a RF mismatch error.  The lam2 is up.

>>> 'lam2' problem from jimmoon -- Tue Jun 20 10:00:47 1989 <<<


RF MISMATCH, just like before.  I ran the clean program for
an HOUR before trying the etch.  I am using J. Chen's etch
recipe, contained on a ROM module labeled with Jian's name on it.
The regular etch recipe is too fast for what we are doing.
I don't care if the machine runs using the regular recipe.
It does NOT run using Jian's recipe, and it has in the past.
Please fix the lam ASAP.

>>> 'lam2' problem from rnorman -- Tue Jun 20 16:45:48 1989 <<<

Problem: RF mismatch error.

Cause: A combination of the chamber being dirty and too large a
       tuning ranged before it starts to tune; dead band too wide.

Solution: The chamber was PM cleaned and a "plasma chamber clean" was
          ran.  Also, the Phase/Mag box, back of chamber, was adjusted
          more sensitive; U1 pin 2 was adjusted to 3.0vdc, pin 5 was adjusted
          to 7vdc, pin 9 adjusted to 4.9vdc and pin 12 adjusted to 5.15vdc.
          Pins 9 and 12 are for the "dead band", pins 2 and 5 are cap motor
          speed.  jmoon ran some wafer and it worked good. The lam2 is up.

>>> 'lam2' problem from robin -- Wed Jun 28 11:54:43 1989 <<<

Arm will not take wafer in from entry air lock to chamber -
stops midway.  Robert Norman has observed the problem and 
will be tending to it shortly.

>>> 'lam2' problem from rnorman -- Thu Jun 29 08:46:58 1989 <<<

Problem: Entry arm stops midway into chamber.

Cause: The ceramic ring around the upper electrode fell down on to
       the lower electrode.

Solution: The chamber was vented and the ceramic ring was replaced.
          The lam2 is up.

>>> 'lam2' problem from voros -- Mon Jul 10 08:38:18 1989 <<<

The last user,Martin, etched nitride in lam2.
Pls take a look at the chamber, how clean it is and run the clean
recipe. Thank you.

>>> 'lam2' problem from rnorman -- Mon Jul 10 09:26:55 1989 <<<

Problem: Nitride use causing possible contamination.

Solution: I vented the system and it is very clean still. At this time
          a chamber plasma clean is being ran and the lam2 will be up
          in 10 min. from now.

>>> 'lam2' problem from davor -- Tue Jul 18 17:02:02 1989 <<<

I ran a single wafer through an SiO2 etch, but after it was completed,
the machine would not unload the wafer because the cassette was not in
pla;ce at the receiving end.  It seems (to me and Tom B.) that the 
sensor is stuck.  Sad to say, my wafer is still inside the belly of the
beast.  Any help will be appreciated. Thanks.
Davor

>>> 'lam2' problem from rnorman -- Wed Jul 19 09:40:35 1989 <<<

Problem: System would not unload wafer due to "load cassette" interlock
         on the exit side.

Cause: The cassette "load" sensor was twisted out of adjustment, so was not
       detecting the cassette.

Solution: Adjusted the sensor back into possition. The lam2 is up.

NOTE: The sensor problems is caused by users pulling the cassette out
      in the down possition. Please make sure the cassette is up before
      removing.

>>> 'lam2' problem from robin -- Fri Jul 21 13:42:16 1989 <<<

Track carrying wafer from exit load lock to receiving cassette moves very
slowly, with jerking motion.  

>>> 'lam2' problem from rnorman -- Fri Jul 21 16:27:05 1989 <<<

The exit load lock belts are moving very slow, but the lam will
still operate.  Monday I will replace the belts.  
The lam2 is still up for use.

>>> 'lam2' problem from field -- Mon Jul 24 11:36:20 1989 <<<

pressure very jumpy; the alarm went off during the chamber clean
and my run.

>>> 'lam2' problem from rnorman -- Thu Jul 27 15:41:37 1989 <<<

Problem: The exit belts to the cassette move real slow.

Cause: Some of the belts were worn out and loose.

Solution: I changed the motor belts and one of the front belts.
          Tha lam was tested and works well.

>>> 'lam2' problem from kjordan -- Thu Aug  3 14:40:16 1989 <<<

Gian taught me how to use LAM2.  During the training session, 
the output cassette would not come up properly.

>>> 'lam2' problem from rnorman -- Thu Aug  3 15:16:10 1989 <<<

Problem: Exit cassette not indexing up.

Cause: The sensor was out of adjustment.

Solution: Adjusted top sensor and tested. The lam2 is up.

>>> 'lam2' problem from gian -- Mon Sep 18 16:17:42 1989 <<<

Exit track is running slowly. Otherwise, lam2 is operational.

>>> 'lam2' problem from rnorman -- Wed Sep 20 08:11:01 1989 <<<

Problem: Exit track running slowly.

Cause: 2 loose belts.

Solution: The track was turned on and tested, and the belts were a
          little slow; but the motor speed did not change after disconnecting
          all the belts. I replaced the 2 back belts, because they were
          not as taunt as the others. The track was tested again and no
          major differance was noticed. The lam2 is up.

>>> 'lam2' problem from kjordan -- Fri Sep 22 15:10:02 1989 <<<

exit cassette does not come up at end of run.  neither does it come
up when the cassette is tilted back.

>>> 'lam2' problem from jlou -- Sun Sep 24 21:27:30 1989 <<<

receiving cassette dose not work well.
It can not fall back to the buttom.

>>> 'lam2' problem from rnorman -- Mon Sep 25 07:30:59 1989 <<<

Problem: Exit cassette indexer not indexing when loading or
         unloading cassette.

Cause:  USERS ARE UNLOADING CASSETTE **WRONG**
        This has happened many times in the past!

NOTE: DO NOT pick the cassette up when it is in the down position;
      the cassette hits the indexer sensor and the indexer will not work.
      Tilt the cassette back easily and reposition it and the indexer will 
      bring the cassette to the top to be unloaded properly.

Solution: The sensor was adjusted and the indexer works fine now.
          Please use the proper procedure to unload the cassette.

>>> 'lam2' problem from field -- Wed Oct 25 16:31:42 1989 <<<

pressure alarm during step 1 of standard oxide etch.
so pressure must be having problems stabilizing.

>>> 'lam2' problem from rnorman -- Thu Oct 26 07:12:22 1989 <<<

Problem: Pressure alarm during step1.

Cause: Could not duplicate the problem.  We did just change
       the CF4 gas bottle yesterday, that may have had some
       effect on the stabilization.

Solution: I ran a plasma without a wafer and a plasma with a
          wafer and the "Chamber Clean" recipe with no pressure
          stabilization problem.  The lam2 is up.

>>> 'lam2' problem from vilma -- Thu Oct 26 11:17:20 1989 <<<

esI ran some oxide testwafer to condition the etcher, l have problem
with the stabilization step , some alarm at the front panel say about
the pressure. I push field select to go to another step.
Solution to this problem l encounter l change the stabilization time to
20 sec. only instead of 30 sec. I ran more wafers, and did not encounter
anymore alarm signal about the pressure.

>>> 'lam2' problem from bob -- Fri Oct 27 15:26:21 1989 <<<

The stabilization of the mfc does not appear to effect the use of lam2.
The machine is up for use. RObert Norman will check the D to A converter
and spans in the machine and also check the pressure regulators on the
gas sources.
lam2 is up.

>>> 'lam2' problem from rnorman -- Mon Oct 30 07:56:10 1989 <<<

Problem: Users reported a gas stabilization error.

Cause: I am sorry to report that I can not duplicate the
       error, again.  

Solution: I ran the lam the first thing in the morning, running
          three different recipes and no problem occurred.  Someone
          needs to show me the problem; possibly the user is modifying
          the recipe, which is causing the error.  The lam2 is up.
~

>>> 'lam2' problem from rnorman -- Mon Oct 30 13:17:06 1989 <<<

The lam software has been upgraded to Rev. AH, software 7.33.
This software is to correct some problems in the SECS link.  
I have a detailed discription of the software modifications if
you want a copy.  The lam2 is up.

>>> 'lam2' problem from tom -- Wed Nov  8 10:27:27 1989 <<<

Plug for the program modules came loose. Needs to be screwed back into
position.

>>> 'lam2' problem from rnorman -- Wed Nov  8 12:47:19 1989 <<<

Problem: The program module connector came loose; unable to plug
         in recipe module.

Solution: Tightened down fastening screws of connector.  The lam2 is up.

>>> 'lam2' problem from carlos -- Sun Nov 12 20:11:37 1989 <<<

It seems that the electrodes are stuck together. My wafer is in the
entrance chamber and it cannot get inside the reactor chamber because the
mechanical arm cannot get inside the reactor chamber.

>>> 'lam2' problem from rnorman -- Mon Nov 13 08:49:28 1989 <<<

Problem: The mechanical atm can not go into chamber.

Cause: The ceramic insulator ring on the upper electrode fell
       down, because the set screws loosened up due to vibration.

Solution: The chamber was vented and the ceramic ring removed and
          cleaned.  The whole chamber was covered with polymer,
          nitride looking type.  A full chamber clean was done
          to remove the polymer.  The lam2 is now running a 
          plasma clean to remove residue from the cleaning solvents.
          The lam2 will be up for use by 10am today.

>>> 'lam2' problem from gian -- Tue Nov 14 16:08:19 1989 <<<

uI had very erratic etch rates for the high selectivity etch ranging
from 2000A/27 seconds to 650A/27seconds.  The wafers were processed in sequence,
and the oxide thickness were measured on a ~7000A field oxide using
the nanospec.

Could something be loose inside the chamber??

>>> 'lam2' problem from rnorman -- Fri Nov 17 06:53:26 1989 <<<

Problem: Very erratic etch rates from 2000A/27 sec. to 650A/27 Sec.

Cause: The only think that can cause such changes in etch rates are;
       the gap spacing changes dramaticly, inwhich a "gap" error
       would occure; and the RF applied power changing dramaticly. 

Solution: The ROR in the chamber is about 6mt/min, this has been
          decreasing  everyday since the chamber clean; before the
          clean it was 8.7 mt/min.  If we do not get a "gap" error,
          I supect the users wafers had a slightly different material
          on them that inturn produced the dramatic etch rates. The
          lam2 is up.

>>> 'lam2' problem from field -- Tue Nov 21 12:22:56 1989 <<<

the gap would move up to only 1.23 cm spacing.
Robert Norman is looking at it.

>>> 'lam2' problem from rnorman -- Tue Nov 21 12:24:18 1989 <<<

We are getting error: Gap Spacing loop not stable.  The gap will
move closer, but will not go up.  I will look into it after lunch.

>>> 'lam2' problem from rnorman -- Tue Nov 21 14:49:54 1989 <<<

The gap drive is now working, but the GAP display is not.  I will
continue repair tomorrow.  DO NOT OPERATE.

>>> 'lam2' problem from rnorman -- Wed Nov 22 09:41:35 1989 <<<

Problem: Gap not adjusting to recipe.

Cause: The gap motor drove past the lower limit and got stuck.
       Also, a connector to the Analog Input PCB was loose and
       not making the proper connection; so, the gap display
       was not showing movement.

Solution: The gap housing was unstuck by switch the gap direction.
          The connector to the Analog Input PCB was securely connected.
          The lam2 was tested and is up for use.

>>> 'lam2' problem from martin -- Wed Nov 29 16:14:21 1989 <<<

cannot load recipe modules.
connector in lam is loose\

>>> 'lam2' problem from rnorman -- Thu Nov 30 13:13:32 1989 <<<

Problem: Can not load recipe module.

Cause: The module connector was loose and preventing module
       loading.

Solution: The mounting screws were tighened down with Loc-tight.
          The lam2 was tested and is up for use.

>>> 'lam2' problem from rnorman -- Tue Dec  5 06:58:25 1989 <<<

The Quick-Disconnect fitting on the blower going to the filter
unit is leaking oil on the floor.  Some towels have been placed on the 
floor to catch the leak until it can be fixed.

The above problem have not effect on process, THE LAM2 IS UP.

>>> 'lam2' problem from parrish -- Tue Dec  5 11:14:18 1989 <<<

problem:   oil leaking on to the floor

cause:     the leak looks as if it is comming from the quick-disconnect 

solution:  moved the fitting off the plane of the floor, It will have to be
	   observed to make sure the pan itself is not leaking. 

>>> 'lam2' problem from field -- Tue Dec 12 15:27:28 1989 <<<

cleared my mistaken problem entry (if I understand this software!)

>>> 'lam2' problem from tang -- Sat Dec 23 02:26:14 1989 <<<

While running chamber clean program, with [process only], the
program was stuck at step 1, with "GAP" flashing, and the
gap spacing stop at 0.97 cm. The recipe specifies a gap of
0.4 cm for step 1.

When I abort the process by manually selecting the end point
through all the steps, the process end with a gap of 1.07 cm,
but the recipe requests 1.2 cm at idle.

So the gap movement mechanism is out of order. There is no wafer
in the system.

>>> 'lam2' problem from aplee -- Sat Dec 23 14:51:58 1989 <<<

esTried to run chamber clean process to see if gap is stabled by one night's
sleep. Obviously it didn't, and it terminated at 0.68 which is way low of
the 1.20cm gap it is supposed to be at idle.

>>> 'lam2' problem from field -- Thu Dec 28 12:06:14 1989 <<<

the gap can not increase to the required 1.2 cm during the
cleaning - it reaches .51 cm and can go no further.  During
the first step of the cleaning, it can reach the required
.4 cm gap just fine.

>>> 'lam2' problem from rnorman -- Tue Jan  2 13:21:32 1990 <<<

We have a serious problem with the gap drive.  We have a drive
motor out and possibly a bent worm gear or bad bearings.  I will
pull the upper electrode assembly and look closer at each gap motor.
It would be safe to say the lam2 will not be up at least until Friday.
Users repeatingly trying to use the lam2 WHEN REPORTED DOWN may have
contributed to the problem.

>>> 'lam2' problem from rnorman -- Wed Jan  3 06:31:30 1990 <<<

After looking more closely at the gap drive motors it was found that
3 gap drive motors went out; lam P/N 676-00504-003.   I will also be
replacing the gap brake; lam P/N 853-1845-1.  Since the upper electrode
is completely pulled out it is to our advantage to replace the brake now
and not wait until it fails; it is smooth and has a burnt look to it, a
sign of a "going out" brake according to Lam.  The above parts were ordered
and will be picked up today.  If all goes well the lam2 will be up by
Friday.

>>> 'lam2' problem from rnorman -- Wed Jan  3 14:54:47 1990 <<<

The gap motors have arrived and will be installed tomorrow morning. If
things go well the lam2 will be up for use early Friday.
Please make appointments for re-qualification.
***DO NOT OPERATE***

>>> 'lam2' problem from rnorman -- Thu Jan  4 14:58:00 1990 <<<

The motors have been installed and I am now adjusting the upper
electrode to be parallel with the lower electrode.  It should be
completed tomorrow on schedule. ***DO NOT OPERATE***
Please make an appointment to get re-qualified if you have not
already.

>>> 'lam2' problem from rnorman -- Fri Jan  5 15:47:53 1990 <<<

The electrodes are now parallel and the system is under vacuum.
A plasma clean was tempted but an RF mismatch occurred.  I think
a RF cable fried.***DO NOT OPERATE*** the lam will be down for the
weekend.

>>> 'lam2' problem from rnorman -- Mon Jan  8 10:57:48 1990 <<<

Problem: Gap not adjusting to proper setting.

Cause: 3 gap spacing motors went out and 1 motor could not
       drive gap.

Solution: All four motors were ordered and replaced.  The upper
          electrode was set parallel with the lower electrode to
          within 0.002" from corner to corner.  During a plasma test
          an RF Mismatch occurred do to an arc to wire inside the
          matching network. The wire was replaced and tie-wrapped down
          so not to repeat.  A plasma clean was ran successfully with
          no errors.  The lam2 is up.

>>> 'lam2' problem from mudie -- Fri Jan 12 14:13:58 1990 <<<

motor problem on lam2 from mudie (12-jan-1990 14:10)

User Comments:
pump stopped working after I tripped on power cord
test, please ignore

>>> 'lam2' problem from mudie -- Fri Jan 12 14:44:05 1990 <<<

motor problem on lam2 from mudie (12-jan-1990 14:10)

User Comments:
pump stopped working after I tripped on power cord
test, please ignore


Comments from mudie at 12-jan-1990 14:43 :
motor on order, due to arrive 1/15/90

>>> 'lam2' problem from mudie -- Fri Jan 12 15:00:27 1990 <<<

motor problem on lam2 from mudie (12-jan-1990 14:10)

User Comments:
pump stopped working after I tripped on power cord
test, please ignore


Comments from mudie at 12-jan-1990 14:43 :
motor on order, due to arrive 1/15/90

Comments from mudie at 12-jan-1990 15:00 :

clearing dummy problem

>>> 'lam2' problem from mudie -- Mon Jan 22 15:32:01 1990 <<<

testing lock function, please ignore

>>> 'lam2' problem from mudie -- Mon Jan 22 15:32:44 1990 <<<

clearing test problem

>>> 'lam2' problem from weijie -- Fri Jan 26 00:48:34 1990 <<<


Before I start my std process, the machine thought it has wafers
in the chamber and I had to use "clear chamber" and put a dummy
wafer on the receiving track to fool it.  Others are fine.

>>> 'lam2' problem from rnorman -- Fri Jan 26 06:14:52 1990 <<<

Problem: Had to use "Wafer clean out" before running.

Cause: If someone does a "process only" chamber clean
       you will get the "wafer in system" error even if no 
       wafers are in the system. 

Solution: If you know FOR SURE that no wafer is in the chamber you
          can clear the "wafer in system" error by toggling the 
          "wafer in system error" on the parameters page.  If you
          are not sure about a wafer in the chamber then you
          must run the "wafer clean out" to make sure any possible
          wafer is removed from the chamber.  This happens sometime,
          but it is not a problem.  The lam2 is up. 

>>> 'lam2' problem from parrish -- Fri Jan 26 06:59:35 1990 <<<

system down for repair of end bearing noise.

>>> 'lam2' problem from parrish -- Fri Jan 26 12:34:04 1990 <<<

problem:    end bearings of the blower noisy

cause:      need the bearings lubricated

solution:   removed end plate, removed old grease, and relubed bearings
            with Yvac 3 fomblin grease. system is up.

>>> 'lam2' problem from ried -- Sun Feb  4 18:05:46 1990 <<<

I started to etch a stack of wafers and walked away.  When I came
back I found that the first wafer had not come out of the etch chamber,
but the second wafer was already in the etch chamber, and the third
wafer was in the entrance load lock.  The alarm condition was that
no wafer had come onto the output belt.  I dropped a dummy wafer
onto the belt to clear the alarm, after which the machine brought
the second wafer into the output load lock and the third wafer into
the etch chamber.  Eventually the third wafer came out also.  I ran
the wafer clean out, but the problem is that THERE IS STILL A WAFER
STUCK IN THE ETCH CHAMBER SOMEWHERE.

>>> 'lam2' problem from rnorman -- Mon Feb  5 08:04:29 1990 <<<

Problem: Wafer lost in chamber.

Cause: Unknown, possibly do to polymer or PR on the back of the
       wafer; we will watch for further problems like this in the
       future.  The chamber was vented and a WHOLE wafer was removed
       and set on the top of the lam2.  A chamber clean was ran and
       the lam2 is up for use.

>>> 'lam2' problem from rnorman -- Tue Feb  6 11:28:51 1990 <<<

Lam2 RF power supply has is not turning on.  There is power out of
the plug, 208V, but the AC ON LED is not on;  the POWER switch
is on.  We may have lost a fuse internally or an internal supply.
Lam2 is down.

>>> 'lam2' problem from rnorman -- Tue Feb  6 14:44:59 1990 <<<

Problem: RF supply not turning on, no AC power.

Cause: The 2 line fuses, under the remote cable, were blown.

Solution: Replaced both fuses.  The lam2 is up.

>>> 'lam2' problem from aplee -- Fri Feb  9 15:28:46 1990 <<<

When I tried to etch through 2.2 um of oxide, using 750 watts power,
the opening holes become brownish and after a long time of etching,
the iv probing shows that it still isn't etched through. The probe 
can scratch off the brownish stuff a bit, and I can see greenish and
redish scratches. It is a critical step to me and some other guys.
>>> 'lam2' problem from aplee -- Fri Feb  9 15:35:22 1990 <<< [No Comment]

>>> 'lam2' problem from ried -- Sun Feb 11 17:55:54 1990 <<<

Status screen has "low water flow" flashing on screen and lam1 has "coolant ovrtmp"
flashing on screen, so I decide not to activate.  Please advise.

>>> 'lam2' problem from bob -- Mon Feb 12 08:22:56 1990 <<<

The DI cooling on lam2 dipped below the 10 megohm trip off
point indicating a decline in resistivity below the 10 megohm 
fault point on the chiller. This is turn shuts off the chiller. 

DI is produced by a shunt loop through a 10" resin bed. This
resin bed (10" filter size) is becoming exhausted will be 
replaced from stock. I have added this to rnormans techjobs.

Until then, the shunt loop flow has been increased from "2"
to "3" on the flow meter. This has raised the resistivity
to 15+ megohms.  The DI quality need only be ~2-4 megohms for 
proper operation of the lam2. The "fault off" setting has been 
at 10 megohms and I will discuss with rnorman the merits of 
lowering it to 5 megohms.

Ironically, checking the chiller is on the maintenance calendar and was
mailed out Feb 11th to rnorman! Resin saturation is difficult
to determine and it tends to drop quickly upon exhaustion.

lam2 is up!

>>> 'lam2' problem from tom -- Wed Mar  7 14:54:07 1990 <<<

CF4 flow 60 and dropping when it should be at 90.
I checked the gas bottle and it looks to be empty, zero presure
even though the valves are open. Needs to be changed.

>>> 'lam2' problem from evan -- Thu Mar  8 08:45:25 1990 <<<

A new FREON-14, CF4, cylinder has been installed.

>>> 'lam2' problem from rnorman -- Thu Mar  8 11:32:11 1990 <<<

The pressure rate of rise in the chamber is very high above
100 mt/min.  After lunch today I will vent the chamber up
and take a look inside; this will be about 12:30.  If 
an obvious problem is not found it could be down for
the rest of the day or even tomorrow.  If you have a 
problem with this, please inform ASAP today.

>>> 'lam2' problem from rnorman -- Thu Mar  8 14:40:57 1990 <<<

The lam2 will be leak checked tomorrow morning to find the massive
leak.  Doing a ROR test it was found to be 327mt/min; this is not
a leak this is a hole.  If you do not mind the leak, you can operate
the lam2, because tomorrow when I start leak checking the lam2 will
be down until it is found.

>>> 'lam2' problem from rnorman -- Fri Mar  9 13:21:48 1990 <<<

Problem: The ROR in the chamber was very high, more then 200 mt/min.

Cause: Both Chamber Isolation valves were leaking across the 80 psi drive
       seal, causing a massive leak.

Solution: Both iso valves were rebuilt, replacing o-rings and repacking.
          The lam2 was tested and the ROR is much better, though a little
          high due to outgassing of the newly rebuilt valves; after a
          couple hours being under vacuum the ROR will decrease.  The
          lam2 is up.

>>> 'lam2' problem from rnorman -- Wed Mar 21 11:16:20 1990 <<<

We are getting "Warning: transmit error".  This has to do with
the SECS communication and will not effect your process, so
please ignore.  The lam2 is up.

>>> 'lam2' problem from cjkim -- Thu Mar 22 01:47:38 1990 <<<

Have damaged PR (dots all over the wafer) after 1min 45sec standard
recipe O2 etch.

>>> 'lam2' problem from rnorman -- Thu Mar 22 07:29:24 1990 <<<

User reported dots all over his wafer.  I have seen this problem
before, if the dots are uniform over the wafer.  This is cause by
the gap space being too close to the wafer for the process that
is being ran.  The lams are set up for one type of process,
for a specific type of process wafer and thickness, if deviations
from this are ran problems may and have occurred.  I would like to
see the wafer that has the dots to help correct problem; please
contact me.

>>> 'lam2' problem from bob -- Fri Mar 23 10:57:33 1990 <<<

The following maintenance will be performed on lam2 to re-establish
a reproduceable baseline oxide etch process:

1) Physical inspection of chamber by Process Staff
   Supervisor/Lab Mgr
2) Replacement of the upper electrode (save old for backup)
3) Cleaning of the chamber and windows
4) Clean of the vacuum manifold
5) Replacement of the oil filters
6) Calibration of all analog inputs
7) RF calibration
8) Calibrate mfc's
9) Process staff to run a standard SiO2 contact etch

The above maintenance will require 3 days of work and will
commence on Tuesday, March 27th. lam2 will be down for this
period. Results will be posted upon completion.

>>> 'lam2' problem from jlou -- Sun Mar 25 23:13:57 1990 <<<

After I finish my Betching job, I load clean chamble recipe. I find the pressre is not correct. Lam 2 is in loop stable waiting step.
                                                                        Jlou

>>> 'lam2' problem from rnorman -- Mon Mar 26 07:45:03 1990 <<<

When I came upon the lam2 CF4 was flowing at 90 sccm and the pressure
was trying the stabilize at 2.8 torr.  The pressure fluctuates from
2.776 to 2.822 torr; I do not remember what the normal pressure
fluctuations are, but this seems too much.  I reset the system to
stop CF4 flow and ran a plasma clean for a test.  The pressure
stabilized per say, that is there was no loop error, but the
pressure still fluctuates when running the "clean".
I will look into this fluctuation problem.  The RF power is not
fluctuating, just the process pressure.  You may run the lam2 if
this problem does not effect your process.

>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>

the upper graphite electrode on lam2 can be resurfaced and
purified by POCO Graphite of Decatur, Texas. The contact
at POCO is Ran Mead. The cost is $80.00 and minimum billing
is $200. 2 electrodes have been sent and return time is
estimated @ 4-5 weeks. Another user of this their service
is Intel.

POCO Graphite Inc.
1601 South State St
Decatur, Texas
800-433-5547

>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>

>>> 'lam2' problem from bob -- Tue Mar 27 14:13:44 1990 <<<

lam2 is down for a chamber. It should be returned for service
after requalification by the Process Supervisor. This should be
Thursday, April 5th in the am.

>>> 'lam2' problem from rnorman -- Tue Mar 27 15:02:48 1990 <<<

The upper electrode is replaced and the chamber is clean.  Tomorrow
I will calibrate the electronics.  It should be up for use by tomorrow
night.

>>> 'lam2' problem from rnorman -- Wed Mar 28 14:37:52 1990 <<<

So far so good!  Everything is pretty much in alignment or
adjustment.  I will give a detailed write up tomorrow when
I finish.  I still have to complete the RF alignment and
check the gap spacing.  It MAY be done by noon tomorrow,
but for sure sometime tomorrow.
s

>>> 'lam2' problem from parrish -- Thu Mar 29 12:32:34 1990 <<<

the oil filter elements has been changed.

>>> 'lam2' problem from rnorman -- Thu Mar 29 12:32:04 1990 <<<

Problem: Yearly PM on lam2

Solution: Below is a list of what was done:

 1) Graphite upper electrode was replaced.
 2) Chamber was totally cleaned; windows, side walls, electrode.
 3) Calibration of Analog System; was right on.
 4) Pressure manometer zero calibration; used Vacuum General
    precision manometer as a reference, off by 2 mt.
 5) MFC zero calibration; some off by 2-3 sccm.
 6) Calibration of the RF Interface Board; reflected power indicated
    lower then actual by 2-3 watts.
 7) Electrode Parallelism and Gap Spacing calibration; was parallel
    with in .002" at outer edge of electrode(after graphite electrode
    change).  Gap spacing was off by +37 counts or a .0187" larger gap.

All in All the system was pretty much in calibration.  Cleaning wise, 
this is the CLEANEST the chamber has ever been, because I scrubbed the
side walls this time.  At this time Debra is running a process check
of the system.  The lam2 is ready for use.

>>> 'lam2' problem from tom -- Thu Mar 29 16:24:35 1990 <<<

Test etch ran after total system clean.

	A 30 second test etch was ran on a thermal oxide wafer.
Using the standard etch recipe, low selectivity etch with no overetch
the etch depth (on average) was 2240 A. 

	This gives an etch rate of 4480 A/min.

	Another identical wafer was etched to clear and took about 
1 min. 10 seconds to clear (L/S etch) and then the standard 20 sec.
H/S overetch. Inspection reveals a nice clear etch. Endpoint looked
good. BTW, both wafers had 5000 A thermal oxide and had the dark 
field resolution mask on them.

*** No nitride etch allowed until further notice! ***

>>> 'lam2' fix from phillip -- Wed Apr 11 11:40:02 1990 <<<

Connected lamlink #2 to argon computer. It should
be up and running barring any software modifications
that Lauren needs to make.

r.p.o.  ttyh3 to ml 2/3 to TW/4 to lam2

>>> 'lam2' problem from jimmoon -- Tue Apr 17 07:29:59 1990 <<<

Etched 23 wafers, as reported in comment log.  There
were many "RF MISMATCH" errors, which caused the etch to terminate
after 11-13 seconds.  This didn't happen every time; 
occasionally (about once every ten etches or so) it would
etch just fine for the 40 seconds that I needed.
I was using the standard etch recipe, modified so that only
step #2 (the low selectivity, 850W) step was being used for
etching.

>>> 'lam2' fix from rnorman -- Wed Apr 18 13:12:25 1990 <<<

Problem: RF mismatch error after about 11-13 seconds into process.

Cause: Jimmoon  thinks the problem is with his wafers not the lam2.

Solution: See jimmoon's comment concerning this problem.  The lam2 is up.

>>> 'lam2' fix from rnorman -- Mon Apr 23 11:59:08 1990 <<<

Problem: RF mismatch error at about 10 seconds into process.

Cause: It could be many things but I did find the blower OFF.

Solution: The blower was turned back on, also the "blower alarm".
         It could have been off since last week when jimmoon was having
         problems.  The lam2 is up for use.

>>> 'lam2' fix from rnorman -- Mon May  7 08:57:39 1990 <<<

Problem: Blower power box cover removed/broken.

Solution: The cover was replaced.  This is to protected the blower
        from being turned off accidently.

>>> 'lam2' problem from judy -- Mon May 14 09:40:54 1990 <<<

RF power mismatch on clean proceedure.  The control panel is hung.  Help?!

>>> 'lam2' problem from rnorman -- Tue May 15 07:22:52 1990 <<<

The electronics were locked up and the lam 2 needed reset.  I will inspect
the chamber today to see if it needs cleaned.  

NOTE: the lam2 is UP for use.
